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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:40:08Z	Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization	Hsu, YC; Shao, TL; Yang, CJ; Chen, C
國立交通大學	2014-12-08T15:03:37Z	Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates	Lin, C. K.; Chen, Chih; Yu, H. M.; Lan, J. K.; Lee, D. L.
國立中山大學	2009	Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints	M.H.R. Jen;L.C. Liu;Y.S. Lai
國立成功大學	2021-04	Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment	Ku;Pu-Hsin;Liang;Chien-Lung;Lin;Kwang-Lung
中華大學	2008	Electromigration-aware Rectilinear Steiner Tree Construction for Analog Circuits	顏金泰; YAN, JIN-TAI
元智大學	2022-11-18	Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints	C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho
國立臺灣大學	2005-06	Electromigration-induced grain rotation in anisotropic conducting beta-tin	Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R.
國立成功大學	2011-08	Electromigration-induced microstructural evolution in lead-free and lead-tin solders	Lin, Kwang-Lung
國立交通大學	2014-12-08T15:11:17Z	Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes	Wei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N.
元智大學	May-23	Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention	P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho

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