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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 381041-381050 / 2348971 (共234898页)
<< < 38100 38101 38102 38103 38104 38105 38106 38107 38108 38109 > >>
每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:40:08Z |
Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization
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Hsu, YC; Shao, TL; Yang, CJ; Chen, C |
| 國立交通大學 |
2014-12-08T15:03:37Z |
Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
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Lin, C. K.; Chen, Chih; Yu, H. M.; Lan, J. K.; Lee, D. L. |
| 國立中山大學 |
2009 |
Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints
|
M.H.R. Jen;L.C. Liu;Y.S. Lai |
| 國立成功大學 |
2021-04 |
Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment
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Ku;Pu-Hsin;Liang;Chien-Lung;Lin;Kwang-Lung |
| 中華大學 |
2008 |
Electromigration-aware Rectilinear Steiner Tree Construction for Analog Circuits
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顏金泰; YAN, JIN-TAI |
| 元智大學 |
2022-11-18 |
Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints
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C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho |
| 國立臺灣大學 |
2005-06 |
Electromigration-induced grain rotation in anisotropic conducting beta-tin
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Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R. |
| 國立成功大學 |
2011-08 |
Electromigration-induced microstructural evolution in lead-free and lead-tin solders
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Lin, Kwang-Lung |
| 國立交通大學 |
2014-12-08T15:11:17Z |
Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes
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Wei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N. |
| 元智大學 |
May-23 |
Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention
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P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho |
显示项目 381041-381050 / 2348971 (共234898页)
<< < 38100 38101 38102 38103 38104 38105 38106 38107 38108 38109 > >>
每页显示[10|25|50]项目
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