| 國立交通大學 |
2014-12-08T15:17:56Z |
Electromigration lifetime improvement of copper interconnect by cap/dielectric interface treatment and geometrical design
|
Lin, MH; Lin, YL; Chen, JM; Yeh, MS; Chang, KP; Su, KC; Wang, TH |
| 國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
|
Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立高雄應用科技大學 |
1975-03 |
Electromigration Mechanisms in Thin Film Conductors
|
H. L. Huang; Chi-Yang Chang; 黃暉理; 張啟陽 |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads
|
Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立東華大學 |
2004 |
Electromigration of Sn-Zn solders in Contact with Cu
|
宋振銘; 林光隆; 方彥翔 |
| 國立中山大學 |
2009 |
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints
|
M.H. R. Jen;L.C. Liu;Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability characterization in ASE: A state-of-the-art review
|
Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability characterization in ASE: A state-of-the-art review
|
Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization
|
Y.S. Lai;Y.T. Chiu;C.W. Lee |
| 國立成功大學 |
2020- |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines
|
Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung |
| 國立成功大學 |
2020 |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
|
Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, G.-T.;Lin, K.-L. |
| 元智大學 |
2022-10-26 |
Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads
|
C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho |
| 元智大學 |
2023/10/25 |
Electromigration Reliability of Micro Joints with Different Surface Finishes
|
Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho |
| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
|
Song,J. M.; Lai,Yi-Shao |
| 國立交通大學 |
2014-12-08T15:40:08Z |
Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
|
Shao, TL; Lin, KC; Chen, C |
| 國立交通大學 |
2014-12-08T15:40:08Z |
Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization
|
Hsu, YC; Shao, TL; Yang, CJ; Chen, C |
| 國立交通大學 |
2014-12-08T15:03:37Z |
Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
|
Lin, C. K.; Chen, Chih; Yu, H. M.; Lan, J. K.; Lee, D. L. |
| 國立中山大學 |
2009 |
Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints
|
M.H.R. Jen;L.C. Liu;Y.S. Lai |
| 國立成功大學 |
2021-04 |
Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment
|
Ku;Pu-Hsin;Liang;Chien-Lung;Lin;Kwang-Lung |
| 中華大學 |
2008 |
Electromigration-aware Rectilinear Steiner Tree Construction for Analog Circuits
|
顏金泰; YAN, JIN-TAI |
| 元智大學 |
2022-11-18 |
Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints
|
C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho |
| 國立臺灣大學 |
2005-06 |
Electromigration-induced grain rotation in anisotropic conducting beta-tin
|
Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R. |
| 國立成功大學 |
2011-08 |
Electromigration-induced microstructural evolution in lead-free and lead-tin solders
|
Lin, Kwang-Lung |
| 國立交通大學 |
2014-12-08T15:11:17Z |
Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes
|
Wei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N. |
| 元智大學 |
May-23 |
Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention
|
P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho |
