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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2020 Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, G.-T.;Lin, K.-L.
元智大學 2022-10-26 Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho
元智大學 2023/10/25 Electromigration Reliability of Micro Joints with Different Surface Finishes Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho
國立東華大學 2008-12 Electromigration Reliability with Respect to Cu Content in Solder Joint System Song,J. M.; Lai,Yi-Shao
國立交通大學 2014-12-08T15:40:08Z Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization Shao, TL; Lin, KC; Chen, C
國立交通大學 2014-12-08T15:40:08Z Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization Hsu, YC; Shao, TL; Yang, CJ; Chen, C
國立交通大學 2014-12-08T15:03:37Z Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates Lin, C. K.; Chen, Chih; Yu, H. M.; Lan, J. K.; Lee, D. L.
國立中山大學 2009 Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints M.H.R. Jen;L.C. Liu;Y.S. Lai
國立成功大學 2021-04 Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment Ku;Pu-Hsin;Liang;Chien-Lung;Lin;Kwang-Lung
中華大學 2008 Electromigration-aware Rectilinear Steiner Tree Construction for Analog Circuits 顏金泰; YAN, JIN-TAI
元智大學 2022-11-18 Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho
國立臺灣大學 2005-06 Electromigration-induced grain rotation in anisotropic conducting beta-tin Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R.
國立成功大學 2011-08 Electromigration-induced microstructural evolution in lead-free and lead-tin solders Lin, Kwang-Lung
國立交通大學 2014-12-08T15:11:17Z Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes Wei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N.
元智大學 May-23 Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho
國立成功大學 2008-10 Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich Kuo, Shih-Ming; Lin, Kwang-Lung
臺大學術典藏 2018-09-10T15:24:08Z Electromolding for 3D cell culture Lai, Y.-H.; Fan, S.-K.; SHIH-KANG FAN
國立成功大學 2005-08 Electromyographic analyses of global synkinesis in the paretic upper limb after stroke Hwang, Ing-Shiou; Tung, Li-Chen; Yang, Li-Chen; Chen, Yi-Ching; Yeh, Chun-Yu; Wang, Chun-Hou
國立臺灣體育運動大學 2018-01 Electromyographic analysis of hip and knee muscles during specific exercise movements in females with patellofemoral pain syndrome: An observational study Chen, Shuya;Chang, Wen-Dien;Wu, Jhih-Yun;Fong, Yi-Chin
國立成功大學 2006-08 Electromyographic analysis of joint-dependent global synkinesis in the upper limb of healthy adults: Laterality of intensity and symmetry of spatial representation Hwang, Ing-Shiou; Wang, Chun-Hou; Chen, Yi-Ching; Cho, Chlung-Yu; Yeung, Kwok-Tak
國立成功大學 2003-08 Electromyographic analysis of locomotion for healthy and hemiparetic subjects - study of performance variability and rail effect on treadmill Hwang, Ing-Shiou; Lee, Hsin-Min; Cherng, Rong-Ju; Chen, Jia-Jin Jason
國立臺灣師範大學 2016-08-04T09:11:54Z Electromyographic analysis of standing shot put throw 黃長福; Hsiente Peng; Hsiensen Peng; Chenfu Huang
國立臺灣師範大學 2016-08-04T09:11:54Z Electromyographic analysis of standing shot put throw 黃長福; Hsiente Peng; Hsiensen Peng; Chenfu Huang
國立臺灣師範大學 2016-08-04T09:11:54Z Electromyographic analysis of the discus standing throw 黃長福
亞洲大學 2016 Electromyographic assessments of muscle activation patterns during driving a power wheelchair 龍希文;Cheng, T. Y.;Cheng, T. Y.;Jan, Y. K.;Jan, Y. K.;Chen, H. C.;Chen, H. C.;Liau, B. Y.;Liau, B. Y.;*

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