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Showing items 557821-557830 of 2348570 (234857 Page(s) Totally)
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| 臺大學術典藏 |
2019-11-27T02:02:12Z |
Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections
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C. ROBERT KAO;Kao C.R.;Chen Y.-H.;Weng I.-A.;Yang S.;Hung H.-T.; Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO |
| 國立成功大學 |
2013-07-15 |
Low temperature and rapid deposition of ZnO nanorods on Si(100) substrate with tunable optical emissions
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Brahma, Sanjaya; Huang, J-L; Liu, C. P.; Kukreja, L. M.; Shivashankar, S. A. |
| 臺大學術典藏 |
2020-05-12T02:53:33Z |
Low temperature and rapid formation of high quality metal oxide thin film: Via a hydroxide-assisted energy conservation strategy
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WEI-FANG SU;Su, W.-F.;Hsiao, K.-C.;Lu, C.-F.;Cheng, C.-C.;Jao, M.-H.; Jao, M.-H.; Cheng, C.-C.; Lu, C.-F.; Hsiao, K.-C.; Su, W.-F.; WEI-FANG SU |
| 國立臺灣科技大學 |
2016 |
Low temperature annealing effect on photoresponse of the bilayer structures of ZnO nanorod/nanodiamond films based on ultraviolet photodetector
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Huang, B.-R;Ke, W.-C;Peng, Y.-H;Liou, R.-H. |
| 臺大學術典藏 |
2018-09-10T08:17:49Z |
Low temperature annealing for GaAsSbN grown by gas-source molecular beam epitaxy
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Y. T. Lin,;T. C. Ma,;H. H. Lin; Y. T. Lin,; T. C. Ma,; H. H. Lin; HAO-HSIUNG LIN |
| 國立交通大學 |
2014-12-08T15:07:53Z |
Low Temperature Annealing with Solid-State Laser or UV Lamp Irradiation on Amorphous IGZO Thin-Film Transistors
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Zan, Hsiao-Wen; Chen, Wei-Tsung; Chou, Cheng-Wei; Tsai, Chuang-Chuang; Huang, Ching-Neng; Hsueh, Hsiu-Wen |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low temperature Au-Au direct bonding with highly < 111 >-oriented Au films
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Hsu, Wei-You; Wu, John; Chen, Chih |
| 國立臺灣大學 |
2007 |
Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler
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Chang, S.Y.; Chuang, T.H.; Yang, C.L. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler
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Chang, S.Y.; Chuang, T.H.; Yang, C.L.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Low temperature bonding of Pd/Ni assembly for hydrogen purifier
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Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
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