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Institution	Date	Title	Author
國立交通大學	2018-08-21T05:56:49Z	Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu	Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning
國立交通大學	2019-12-13T01:12:49Z	Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package	Yang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng
國立交通大學	2020-01-02T00:04:24Z	Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper	Wu, Yu-Ting; Chen, Chih
國立交通大學	2019-12-13T01:12:49Z	Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films	Chen, Fu-Chian; Wu, Yu-Ting; Chen, Chih
國立交通大學	2014-12-08T15:27:23Z	Low temperature deposited highly-conductive N-type SiC thin films	Cheng, KL; Cheng, HC; Lee, WH; Lee, C; Yew, TR
國立交通大學	2020-10-05T01:59:48Z	Low temperature deposition of high quality single crystalline AlN thin films on sapphire using highly oriented monolayer MoS 2 as a buffer layer	Lu, Li-Syuan; Chueh, Wei-Chen; Chang, Wen-Hao; Chen, Meei-Ru; Chien, Hung-Yi; Kuo, Po-Chun; Kao, Hui-Ling; Chen, Jyh-Shin
臺大學術典藏	2008	Low Temperature Direct Electroless Nickel Plating on Silicon Wafer	Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray; Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray
國立臺灣大學	2008	Low Temperature Direct Electroless Nickel Plating on Silicon Wafer	Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray
臺大學術典藏	2020-05-12T02:53:11Z	Low temperature direct electroless nickel plating on silicon wafer	TUNG-HAN CHUANG; Yang, S.-R.; Chuang, T.-H.; Wang, S.-S.; Jain, C.-C.
國立中山大學	1987	Low temperature effects of flow in sandbed streams	Jin Wu;Ruo-Shan Tseng

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