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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 557831-557840 / 2348570 (共234857頁)
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| 國立交通大學 |
2019-04-02T06:04:16Z |
Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration
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Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Low temperature bonding technology for 3D integration
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Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立彰化師範大學 |
2009-02 |
Low Temperature Carbon Monoxide Oxidation over Gold Nanoparticles Supported on Sodium Titanate Nanotubes
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Tsai, Jui-Ying; Chao, Jiunn-Hsing; Lin, Chiu-Hsun |
| 國立臺灣大學 |
1997 |
Low temperature chemical vapor deposition growth of -SiC on (100) Si using methylsilane and device characteristics
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Liu, C. W.; Sturm, J. C. |
| 臺大學術典藏 |
2018-09-10T06:31:22Z |
Low temperature chemical vapor deposition growth of β-SiC on (100) Si using methylsilane and device characteristics
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Liu, C.W.; Sturm, J.C.; CHEE-WEE LIU |
| 臺大學術典藏 |
1994 |
Low Temperature Coating of Refractory Metal and Carbide on SiC
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Wei, Wen-Cheng; Lo, Ming-Hung; 韋文誠; Lo, Ming-Hung; Wei, Wen-Cheng; Lo, Ming-Hung |
| 國立臺灣大學 |
1994 |
Low Temperature Coating of Refractory Metal and Carbide on SiC
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韋文誠; Lo, Ming-Hung; Wei, Wen-Cheng; Lo, Ming-Hung |
| 國立成功大學 |
2012 |
Low Temperature Cofired Soft Ferrites for High Frequency Applications
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Hsiang, Hsing-I; Hsi, Chi-Shiung; Hsu, Xiao Ci |
| 國立交通大學 |
2020-10-05T02:01:09Z |
Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation
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Tsai, Yi-Chieh; Hu, Han-Wen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:26Z |
Low Temperature Cu-Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
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Panigrahy, Asisa Kumar; Chen, Kuan-Neng |
顯示項目 557831-557840 / 2348570 (共234857頁)
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每頁顯示[10|25|50]項目
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